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MEMS RF Switch Integrated Process





Technology Source: SENSORS DIRECTORATE

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About the Technology:

A low-temperature integrated process for manufacturing RF micro-electromechanical switches (MEMS) in hermetic thin-film encapsulations has been developed and demonstrated. Monolithically integrated tunable filters, phase-shifters, and tunable impedance matching networks are key target applications for these RF MEMS devices. Conventional chip-in-a-box RF packaging fails for RF MEMS integrated circuits because the circuits must be handled after release of the delicate switch beam, often for extended periods in poorly controlled assembly environments. Conventional packaging may also add significant cost and RF transition losses to the circuit. Wafer-bonded caps are a proven alternative to conventional packaging for individual MEMS switches, but have some critical limitations for integrated circuit applications. These limitations include difficulty in arbitrary placement within the circuit (caps defined by sawing must be in a regular rectangular grid), and a relatively large bond ring area compared to the size of the switch.

The integrated thin-film encapsulation approach forms a sealed dielectric package around the device as part of the device fabrication process, so that devices leaving the fabrication facility are fully protected in hermetic enclosures. The capping and sealing processes are done at low temperatures compatible with most RF MEMS devices, forming a low-profile small-footprint low-loss package ideally suited to integrated circuit applications.

Marketability:
This Technology has potential commercial application in cellular handsets where an integrated technology would allow RF MEMS switches to be used for transmit/receive switching, as diversity switches and in tunable filters.

Benefits:
Conventional chip-in-a-box RF packaging fails for RF MEMS integrated circuits because the circuits must be handled after release of the delicate switch beam, often for extended periods in poorly controlled assembly environments. Conventional packaging may also add significant cost and RF transition losses to the circuit. Wafer-bonded caps are a proven alternative to conventional packaging for individual MEMS switches, but have some critical limitations for integrated circuit applications. These limitations include difficulty in arbitrary placement within the circuit (caps defined by sawing must be in a regular rectangular grid), and a relatively large bond ring area compared to the size of the switch.

Point of Contact:		Contact Location:
John Ebel Electronics Engineer phone: 937-255-1874 fax: 937-255-8656 email: John.ebel@wpafb.af.mil		Wright Patterson Air Force Base , OH

Documents:		Links:
MEMS RF Switch Integrated Process.pdf		Sensors Directorate